Biomanufacturing of Hierarchical Biocomposites for High-Performance Thermal Interface Materials

Source: sbir.gov Agency: DOD Branch: DARPA Program: STTR Phase I Topic: DPA26TZ03-DV002 Research Area: This topic addresses the thermal management challenge to dissipate the large amount of heat generated by today’s high-density microelectronics and power storage systems to ensure and maintain performance, reliability, and safety [3, 4, 6] Thermal interface materials (TIMs) are a critical component in this thermal management. TIMs are designed to fill microgaps and surface irregularities between the otherwise bare surfaces between device and cooling system. Without a TIM, if two nominally flat an Status: open Requirements: This topic addresses the thermal management challenge to dissipate the large amount of heat generated by today’s high-density microelectronics and power storage systems to ensure and maintain performance, reliability, and safety [3, 4, 6] Thermal interface materials (TIMs) are a critical component i